K Technology Corp. | Electronics R&D for Automotive, Medical, Communications
In addition to the design and manufacturing of electronic devices, our company has long been engaged in highly specialized repair, analysis, and product refurbishment and reus within the after-sales service domain.
In fields such as automotive equipment, medical devices, communication devices, and industrial machinery—where long-term reliability and high-quality standards are essential—we provide comprehensive solutions for product recovery, reuse, and lifecycle extension.
Recent electronic devices have become increasingly miniaturized and densely integrated, making repair upon failure more difficult. At our repair site, technicians certified with soldering qualifications by the Japan Welding Engineering Society are stationed full-time, enabling reinstallation and replacement of micro-components such as 0402 chips and BGAs.
Our rework equipment achieves precise heating control equivalent to reflow conditions and is equipped with fine alignment functions, ensuring high reproducibility and quality. With the skills of experienced mounting technicians, even highly difficult repairs can be handled.
Additionally, by enhancing the heating capacity of the bottom heater and equipping a wide IR bottom heater, we achieve broad adaptability that can also handle large-size boards (L-size).
After rework, X-ray inspection equipment is used to conduct detailed solder joint inspections, preventing defective products from being released. Through advanced technology and a rigorous quality management system, we contribute to improving the reliability of our customers’ products.
Our analysis services employ a multifaceted approach enabled by a wide range of analytical equipment and experienced engineers. We thoroughly investigate product abnormalities and identify the “root cause” of failures or defects.
Non-destructive observation allows internal inspection of samples not visible from the outside. With a micro-focus X-ray source and extremely small focal dimensions, even small samples such as electronic components can be clearly captured.
In addition to simple magnification, three-dimensional observations such as angled and rotational imaging are possible, ensuring no inspection points are overlooked compared to two-dimensional X-ray systems.
Equipped with versatile software functions, including simplified CT, observation video recording, programming functions for efficient mass inspections, and quantitative analysis (dimensional/area measurements).
Samples are embedded in epoxy resin, cut, polished, and buffed, then observed with optical or electron microscopes.
This is effective for detecting cracks in solder joints of surface-mounted components and BGA ICs, which cannot be confirmed externally.
It also allows observation of structural changes in metals and post-reliability test analysis. Observations are conducted using SEM (Scanning Electron Microscope) or optical microscopes.
SEM uses an electron beam to observe surface and cross-sectional structures through secondary electrons.
It provides deep depth-of-field images, particularly at high magnifications, giving a three-dimensional appearance.
Equipped with low-vacuum mode, it allows direct observation of non-conductive samples such as paper, cloth, and resin without metal coating.
EDS is an analytical technique integrated with SEM, enabling detection and measurement of specific elements qualitatively and quantitatively from the observation area.
It also provides elemental distribution images (X-mapping) and line analysis (X-ray line scans).
Qualitative Analysis: Identifies detected elements.
Mapping: Analyzes elemental distribution within the observation field.
Line Scan: Measures elemental intensity along a specific line.
Quantitative Analysis: Measures elemental quantities with accuracy down to a few percent.
By leveraging these instruments and expertise, we visualize hidden defects such as cracks, delamination, corrosion, disconnection, and thermal expansion-related damage, providing quantified reports.
Furthermore, by analyzing the data to identify recurrence conditions and mechanisms, we propose concrete feedback for recurrence prevention and design improvement.
Beyond determining whether recovered or returned defective products can be repaired, we evaluate them from the perspectives of “identifying product weaknesses and improvement methods,” “refining manufacturing processes,” and “enhancing quality assurance methods.”
Based on diagnostic results, reinstallation, component replacement, functional checks, and test evaluations are carried out. Products are then restored to practical levels, further enhancing their overall value.
In addition to reconditioning, we also offer refurbishment services, including cosmetic restoration such as external finishing and chassis repainting.
Refurbished products can be redeployed as spare units for customer shipments or as maintenance stock, effectively reintroduced as good-as-new.
Examples of Refurbishment Services:
Refinishing scratches and dirt on casings
Reapplying labels and identification codes
Re-inspection, re-packaging, and re-shipment readiness
Our after-sales support provides effective solutions such as failure repair, root cause analysis and countermeasures, and refurbishment that gives new value to products otherwise destined for disposal.
For consultations on repair, analysis, reuse, or refurbishment of products, please contact us via the contact form, including product specifications and an overview of the observed issues.
We are an authorized testing center for the Micro Soldering Personnel Certification by the Japan Welding Engineering Society (JWES).
Our soldering school offers both training courses and qualification exams for the Manual Soldering Operator (MOPR) and Inspector (ISP) certifications.
Note: Instruction is provided exclusively in Japanese.